Texas Instruments - HPA02302YZPR

HPA02302YZPR by Texas Instruments

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Manufacturer Texas Instruments
Manufacturer's Part Number HPA02302YZPR
Description SPDT; Temperature Grade: INDUSTRIAL; No. of Terminals: 10; Package Code: FBGA; Package Shape: RECTANGULAR; Surface Mount: YES;
Datasheet HPA02302YZPR Datasheet
In Stock869
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Maximum Time At Peak Reflow Temperature (s): 30
Maximum Switch-on Time: 80 ns
Sub-Category: Multiplexer or Switches
Surface Mount: YES
Terminal Finish: TIN SILVER COPPER
No. of Terminals: 10
Maximum On-state Resistance (Ron): 1.04 ohm
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY, FINE PITCH
JESD-30 Code: R-PBGA-B10
Package Shape: RECTANGULAR
Terminal Form: BALL
Maximum Operating Temperature: 85 Cel
Package Code: FBGA
Switching (V): BREAK-BEFORE-MAKE
Moisture Sensitivity Level (MSL): 1
Normal Position (V): NO/NC
JESD-609 Code: e1
Minimum Operating Temperature: -40 Cel
No. of Functions: 2
Qualification: Not Qualified
Package Equivalence Code: BGA10,3X4,20
Other IC type: SPDT
Output (V): SEPARATE OUTPUT
Peak Reflow Temperature (C): 260
Terminal Pitch: .5 mm
Temperature Grade: INDUSTRIAL
Power Supplies (V): 2.5/5
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Pricing (USD)

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869 - -

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