Texas Instruments - JBP38S03X-20MFK

JBP38S03X-20MFK by Texas Instruments

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Manufacturer Texas Instruments
Manufacturer's Part Number JBP38S03X-20MFK
Description OTP ROM; Temperature Grade: MILITARY; No. of Terminals: 20; Package Code: QCCN; Package Shape: SQUARE; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED;
Datasheet JBP38S03X-20MFK Datasheet
In Stock3,262
NAME DESCRIPTION
Package Body Material: CERAMIC
Organization: 32X8
Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED
Sub-Category: OTP ROMs
Surface Mount: YES
Maximum Supply Current: 125 mA
No. of Terminals: 20
No. of Words: 32 words
Terminal Position: QUAD
Package Style (Meter): CHIP CARRIER
Screening Level: 38535Q/M;38534H;883B
Technology: TTL
JESD-30 Code: S-XQCC-N20
Package Shape: SQUARE
Terminal Form: NO LEAD
Maximum Operating Temperature: 125 Cel
Package Code: QCCN
Memory IC Type: OTP ROM
Minimum Operating Temperature: -55 Cel
Memory Width: 8
Qualification: Not Qualified
Package Equivalence Code: LCC20,.35SQ
Maximum Access Time: 20 ns
No. of Words Code: 32
Nominal Supply Voltage / Vsup (V): 5
Peak Reflow Temperature (C): NOT SPECIFIED
Terminal Pitch: 1.27 mm
Temperature Grade: MILITARY
Power Supplies (V): 5
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