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| Manufacturer | Texas Instruments |
|---|---|
| Manufacturer's Part Number | LM3S1N11-IBZ50-C5 |
| Description | MICROCONTROLLER; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 108; Package Code: LFBGA; Package Shape: SQUARE; |
| Datasheet | LM3S1N11-IBZ50-C5 Datasheet |
| In Stock | 3,531 |
| NAME | DESCRIPTION |
|---|---|
| Minimum Supply Voltage: | 1.235 V |
| Package Body Material: | PLASTIC/EPOXY |
| Maximum Time At Peak Reflow Temperature (s): | 30 |
| Sub-Category: | Microcontrollers |
| Surface Mount: | YES |
| Address Bus Width: | 0 |
| Technology: | CMOS |
| Maximum Clock Frequency: | 16.384 MHz |
| Package Shape: | SQUARE |
| Terminal Form: | BALL |
| Package Code: | LFBGA |
| Moisture Sensitivity Level (MSL): | 3 |
| Bit Size: | 32 |
| DAC Channels: | NO |
| Qualification: | Not Qualified |
| Package Equivalence Code: | BGA108,12X12,32 |
| PWM Channels: | YES |
| Connectivity: | I2C(2), IRDA, LIN, MICROWIRE, SPI, SSI(2), UART(3) |
| Peak Reflow Temperature (C): | 260 |
| ROM Programmability: | FLASH |
| Analog To Digital Convertors: | 8-Ch 10-Bit |
| Terminal Pitch: | .8 mm |
| CPU Family: | CORTEX-M3 |
| Nominal Supply Voltage: | 1.3 V |
| Maximum Seated Height: | 1.5 mm |
| Terminal Finish: | TIN SILVER COPPER |
| ADC Channels: | YES |
| No. of Terminals: | 108 |
| DMA Channels: | YES |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY, LOW PROFILE, FINE PITCH |
| No. of I/O Lines: | 67 |
| JESD-30 Code: | S-PBGA-B108 |
| ROM Words: | 65536 |
| Maximum Operating Temperature: | 85 Cel |
| Width: | 10 mm |
| Data EEPROM Size: | 0 |
| Speed: | 50 rpm |
| Peripheral IC Type: | MICROCONTROLLER |
| Maximum Supply Voltage: | 1.365 V |
| RAM Bytes: | 12288 |
| External Data Bus Width: | 0 |
| Peripherals: | BOD, COMPARATOR(2), DMA(32), POR, PWM(6), RTC, TIMER(4), WDT(2) |
| JESD-609 Code: | e1 |
| Minimum Operating Temperature: | -40 Cel |
| Length: | 10 mm |
| On Chip Program ROM Width: | 8 |
| Temperature Grade: | INDUSTRIAL |
| Power Supplies (V): | 1.2,3.3 |
