Texas Instruments - LM3S8962-IBZ50

LM3S8962-IBZ50 by Texas Instruments

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Manufacturer Texas Instruments
Manufacturer's Part Number LM3S8962-IBZ50
Description Microcontrollers; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 108; Package Code: FBGA; Package Shape: SQUARE;
Datasheet LM3S8962-IBZ50 Datasheet
In Stock1,570
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Speed: 50 rpm
RAM Bytes: 65536
Sub-Category: Microcontrollers
Surface Mount: YES
Bit Size: 32
Minimum Operating Temperature: -40 Cel
No. of Terminals: 108
Qualification: Not Qualified
Package Equivalence Code: BGA108,12X12,32
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY, FINE PITCH
JESD-30 Code: S-PBGA-B108
Package Shape: SQUARE
ROM Words: 262144
Terminal Form: BALL
Maximum Operating Temperature: 85 Cel
Package Code: FBGA
ROM Programmability: FLASH
Terminal Pitch: .8 mm
Temperature Grade: INDUSTRIAL
Power Supplies (V): 2.5,3.3
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