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Manufacturer | Texas Instruments |
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Manufacturer's Part Number | LM4F232H5BBFIGR |
Description | MICROCONTROLLER, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 157; Package Code: FBGA; Package Shape: SQUARE; |
Datasheet | LM4F232H5BBFIGR Datasheet |
In Stock | 4,862 |
NAME | DESCRIPTION |
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Package Body Material: | PLASTIC/EPOXY |
Maximum Time At Peak Reflow Temperature (s): | NOT SPECIFIED |
Sub-Category: | Microcontrollers |
Surface Mount: | YES |
No. of Terminals: | 157 |
Terminal Position: | BOTTOM |
Package Style (Meter): | GRID ARRAY, FINE PITCH |
Technology: | CMOS |
JESD-30 Code: | S-PBGA-B157 |
Package Shape: | SQUARE |
ROM Words: | 262144 |
Terminal Form: | BALL |
Maximum Operating Temperature: | 85 Cel |
Package Code: | FBGA |
Speed: | 80 rpm |
Peripheral IC Type: | MICROCONTROLLER, RISC |
RAM Bytes: | 32768 |
Bit Size: | 32 |
Minimum Operating Temperature: | -40 Cel |
Qualification: | Not Qualified |
Package Equivalence Code: | BGA157,13X13,25 |
Peak Reflow Temperature (C): | NOT SPECIFIED |
ROM Programmability: | FLASH |
Terminal Pitch: | .635 mm |
Temperature Grade: | INDUSTRIAL |
Power Supplies (V): | 1.2,3.3 |
CPU Family: | CORTEX-M4F |