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| Manufacturer | Texas Instruments |
|---|---|
| Manufacturer's Part Number | LMH0344GRE/NOPB |
| Description | LINE EQUALIZER; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 25; Package Code: TFBGA; Package Shape: SQUARE; |
| Datasheet | LMH0344GRE/NOPB Datasheet |
| In Stock | 1,084 |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Nominal Supply Voltage: | 3.3 V |
| Maximum Time At Peak Reflow Temperature (s): | 30 |
| Maximum Seated Height: | 1.1 mm |
| Sub-Category: | Other Telecom ICs |
| Surface Mount: | YES |
| Maximum Supply Current: | .1 mA |
| Terminal Finish: | TIN SILVER COPPER |
| No. of Terminals: | 25 |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY, THIN PROFILE, FINE PITCH |
| Data Rate: | 2970 Mbps |
| JESD-30 Code: | S-PBGA-B25 |
| Package Shape: | SQUARE |
| Terminal Form: | BALL |
| Maximum Operating Temperature: | 85 Cel |
| Package Code: | TFBGA |
| Width: | 3 mm |
| Moisture Sensitivity Level (MSL): | 1 |
| Telecom IC Type: | LINE EQUALIZER |
| JESD-609 Code: | e1 |
| Minimum Operating Temperature: | -40 Cel |
| No. of Functions: | 1 |
| Qualification: | Not Qualified |
| Package Equivalence Code: | BGA25,5X5,20 |
| Length: | 3 mm |
| Peak Reflow Temperature (C): | 260 |
| Terminal Pitch: | .5 mm |
| Temperature Grade: | INDUSTRIAL |
| Power Supplies (V): | 3.3 |
