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| Manufacturer | Texas Instruments |
|---|---|
| Manufacturer's Part Number | LMV228SD/NOPB |
| Description | RF AND BASEBAND CIRCUIT; Terminal Form: NO LEAD; Package Code: HVSON; Package Shape: RECTANGULAR; Terminal Finish: MATTE TIN; Surface Mount: YES; |
| Datasheet | LMV228SD/NOPB Datasheet |
| In Stock | 4,159 |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Maximum Time At Peak Reflow Temperature (s): | 30 |
| Telecom IC Type: | RF AND BASEBAND CIRCUIT |
| Surface Mount: | YES |
| Maximum Supply Current: | 8 mA |
| Terminal Finish: | MATTE TIN |
| JESD-609 Code: | e3 |
| No. of Functions: | 1 |
| Terminal Position: | DUAL |
| Package Style (Meter): | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
| JESD-30 Code: | R-PDSO-N6 |
| Package Shape: | RECTANGULAR |
| Terminal Form: | NO LEAD |
| Peak Reflow Temperature (C): | 260 |
| No. of Channels: | 1 |
| Package Code: | HVSON |
| Moisture Sensitivity Level (MSL): | 1 |
