Texas Instruments - MSP430F2330IYFFR

MSP430F2330IYFFR by Texas Instruments

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Manufacturer Texas Instruments
Manufacturer's Part Number MSP430F2330IYFFR
Description MICROCONTROLLER, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 49; Package Code: FBGA; Package Shape: SQUARE;
Datasheet MSP430F2330IYFFR Datasheet
In Stock3,617
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Maximum Time At Peak Reflow Temperature (s): 30
Sub-Category: Microcontrollers
Surface Mount: YES
Maximum Supply Current: .55 mA
Terminal Finish: TIN SILVER COPPER
No. of Terminals: 49
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY, FINE PITCH
Technology: CMOS
JESD-30 Code: S-PBGA-B49
Package Shape: SQUARE
ROM Words: 8192
Terminal Form: BALL
Maximum Operating Temperature: 85 Cel
Package Code: FBGA
Moisture Sensitivity Level (MSL): 1
Speed: 16 rpm
Peripheral IC Type: MICROCONTROLLER, RISC
RAM Bytes: 1024
Bit Size: 16
JESD-609 Code: e1
Minimum Operating Temperature: -40 Cel
Qualification: Not Qualified
Package Equivalence Code: BGA49,7X7,16
Peak Reflow Temperature (C): 260
ROM Programmability: FLASH
Terminal Pitch: .4 mm
Temperature Grade: INDUSTRIAL
Power Supplies (V): 2/3.3
CPU Family: MSP430
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Pricing (USD)

Qty. Unit Price Ext. Price
3,617 $1.660 $6,004.220

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