
Image shown is a representation only.
Manufacturer | Texas Instruments |
---|---|
Manufacturer's Part Number | MSP430F5255IZQER |
Description | MICROCONTROLLER, RISC; Terminal Form: BALL; Package Code: VFBGA; Package Shape: SQUARE; Terminal Pitch: .5 mm; Peak Reflow Temperature (C): 260; |
Datasheet | MSP430F5255IZQER Datasheet |
In Stock | 1,204 |
NAME | DESCRIPTION |
---|---|
Package Body Material: | PLASTIC/EPOXY |
Peripheral IC Type: | MICROCONTROLLER, RISC |
Maximum Time At Peak Reflow Temperature (s): | 30 |
Maximum Seated Height: | 1 mm |
Surface Mount: | YES |
Terminal Finish: | TIN SILVER COPPER |
JESD-609 Code: | e1 |
Terminal Position: | BOTTOM |
Package Style (Meter): | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
Length: | 5 mm |
Technology: | CMOS |
RAM Words: | 32 |
JESD-30 Code: | S-PBGA-B80 |
Package Shape: | SQUARE |
ROM Words: | 131072 |
Terminal Form: | BALL |
Peak Reflow Temperature (C): | 260 |
Package Code: | VFBGA |
Width: | 5 mm |
Terminal Pitch: | .5 mm |
CPU Family: | MSP430 |
Moisture Sensitivity Level (MSL): | 3 |