Texas Instruments - MSP430F5259IZQE

MSP430F5259IZQE by Texas Instruments

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Manufacturer Texas Instruments
Manufacturer's Part Number MSP430F5259IZQE
Description MICROCONTROLLER, RISC; Terminal Form: BALL; Package Code: VFBGA; Package Shape: SQUARE; Terminal Finish: TIN SILVER COPPER; JESD-30 Code: S-PBGA-B80;
Datasheet MSP430F5259IZQE Datasheet
In Stock3,910
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Peripheral IC Type: MICROCONTROLLER, RISC
Maximum Time At Peak Reflow Temperature (s): 30
Maximum Seated Height: 1 mm
Surface Mount: YES
Terminal Finish: TIN SILVER COPPER
JESD-609 Code: e1
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Length: 5 mm
Technology: CMOS
RAM Words: 32
JESD-30 Code: S-PBGA-B80
Package Shape: SQUARE
ROM Words: 131072
Terminal Form: BALL
Peak Reflow Temperature (C): 260
Package Code: VFBGA
Width: 5 mm
Terminal Pitch: .5 mm
CPU Family: MSP430
Moisture Sensitivity Level (MSL): 3
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Pricing (USD)

Qty. Unit Price Ext. Price
3,910 $3.040 $11,886.400

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