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Manufacturer | Texas Instruments |
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Manufacturer's Part Number | MSP430F6659IZQW |
Description | Microcontrollers; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 113; Package Code: FBGA; Package Shape: SQUARE; |
Datasheet | MSP430F6659IZQW Datasheet |
In Stock | 1,022 |
NAME | DESCRIPTION |
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Package Body Material: | PLASTIC/EPOXY |
Speed: | 20 rpm |
RAM Bytes: | 65536 |
Sub-Category: | Microcontrollers |
Surface Mount: | YES |
Bit Size: | 16 |
Minimum Operating Temperature: | -40 Cel |
No. of Terminals: | 113 |
Qualification: | Not Qualified |
Package Equivalence Code: | BGA113,12X12,20 |
Terminal Position: | BOTTOM |
Package Style (Meter): | GRID ARRAY, FINE PITCH |
Technology: | CMOS |
JESD-30 Code: | S-PBGA-B113 |
Package Shape: | SQUARE |
ROM Words: | 524288 |
Terminal Form: | BALL |
Maximum Operating Temperature: | 85 Cel |
Package Code: | FBGA |
ROM Programmability: | FLASH |
Terminal Pitch: | .5 mm |
Temperature Grade: | INDUSTRIAL |
Power Supplies (V): | 2/3.3 |
CPU Family: | MSP430 |