Texas Instruments - MSP430F6659IZQW

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MSP430F6659IZQW by Texas Instruments

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Manufacturer Texas Instruments
Manufacturer's Part Number MSP430F6659IZQW
Description Microcontrollers; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 113; Package Code: FBGA; Package Shape: SQUARE;
Datasheet MSP430F6659IZQW Datasheet
In Stock1,022
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Speed: 20 rpm
RAM Bytes: 65536
Sub-Category: Microcontrollers
Surface Mount: YES
Bit Size: 16
Minimum Operating Temperature: -40 Cel
No. of Terminals: 113
Qualification: Not Qualified
Package Equivalence Code: BGA113,12X12,20
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY, FINE PITCH
Technology: CMOS
JESD-30 Code: S-PBGA-B113
Package Shape: SQUARE
ROM Words: 524288
Terminal Form: BALL
Maximum Operating Temperature: 85 Cel
Package Code: FBGA
ROM Programmability: FLASH
Terminal Pitch: .5 mm
Temperature Grade: INDUSTRIAL
Power Supplies (V): 2/3.3
CPU Family: MSP430
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