Image shown is a representation only.
| Manufacturer | Texas Instruments |
|---|---|
| Manufacturer's Part Number | OMAP3503DCUS |
| Description | SYSTEM ON CHIP; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 423; Package Code: LFBGA; Package Shape: SQUARE; |
| Datasheet | OMAP3503DCUS Datasheet |
| In Stock | 4,799 |
| NAME | DESCRIPTION |
|---|---|
| Minimum Supply Voltage: | 1.71 V |
| Package Body Material: | PLASTIC/EPOXY |
| Nominal Supply Voltage: | 1.8 V |
| Maximum Time At Peak Reflow Temperature (s): | 30 |
| Maximum Seated Height: | 1.4 mm |
| Sub-Category: | Graphics Processors |
| Surface Mount: | YES |
| Terminal Finish: | TIN SILVER COPPER |
| No. of Terminals: | 423 |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY, LOW PROFILE, FINE PITCH |
| Technology: | CMOS |
| JESD-30 Code: | S-PBGA-B423 |
| Package Shape: | SQUARE |
| Terminal Form: | BALL |
| Maximum Operating Temperature: | 90 Cel |
| Package Code: | LFBGA |
| Width: | 16 mm |
| Moisture Sensitivity Level (MSL): | 4 |
| Other Names: |
TEXTISOMAP3503DCUS 2156-OMAP3503DCUS-TI |
| Peripheral IC Type: | SYSTEM ON CHIP |
| Maximum Supply Voltage: | 1.91 V |
| JESD-609 Code: | e1 |
| Minimum Operating Temperature: | 0 Cel |
| Qualification: | Not Qualified |
| Package Equivalence Code: | BGA423,24X24,25 |
| Length: | 16 mm |
| Peak Reflow Temperature (C): | 260 |
| Terminal Pitch: | .8 mm |
| Temperature Grade: | OTHER |
| Power Supplies (V): | 1.1,1.8,3.3 |
