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| Manufacturer | Texas Instruments |
|---|---|
| Manufacturer's Part Number | OMAP3515DCBB |
| Description | SYSTEM ON CHIP; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 515; Package Code: VFBGA; Package Shape: SQUARE; |
| Datasheet | OMAP3515DCBB Datasheet |
| In Stock | 280 |
| NAME | DESCRIPTION |
|---|---|
| Minimum Supply Voltage: | 1.71 V |
| Package Body Material: | PLASTIC/EPOXY |
| Nominal Supply Voltage: | 1.8 V |
| Maximum Time At Peak Reflow Temperature (s): | NOT SPECIFIED |
| Maximum Seated Height: | .9 mm |
| Sub-Category: | Graphics Processors |
| Surface Mount: | YES |
| No. of Terminals: | 515 |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY |
| Technology: | CMOS |
| JESD-30 Code: | S-PBGA-B515 |
| Package Shape: | SQUARE |
| Terminal Form: | BALL |
| Maximum Operating Temperature: | 90 Cel |
| Package Code: | VFBGA |
| Width: | 12 mm |
| Other Names: |
2156-OMAP3515DCBB-TI -296-28252-ND 296-28252 OMAP3515DCBB-ND -OMAP3515DCBB-NDR TEXTISOMAP3515DCBB |
| Peripheral IC Type: | SYSTEM ON CHIP |
| Maximum Supply Voltage: | 1.89 V |
| Minimum Operating Temperature: | 0 Cel |
| Qualification: | Not Qualified |
| Package Equivalence Code: | BGA515,23X23,20 |
| Length: | 12 mm |
| Peak Reflow Temperature (C): | NOT SPECIFIED |
| Terminal Pitch: | .5 mm |
| Temperature Grade: | OTHER |
| Power Supplies (V): | 1.1,1.8,3.3 |









