Texas Instruments - OMAPL137CZKBD

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OMAPL137CZKBD by Texas Instruments

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Manufacturer Texas Instruments
Manufacturer's Part Number OMAPL137CZKBD
Description SoC; Terminal Form: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE; Maximum Seated Height: 2.05 mm;
Datasheet OMAPL137CZKBD Datasheet
In Stock2,918
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Peripheral IC Type: SoC
Maximum Seated Height: 2.05 mm
Surface Mount: YES
Minimum Operating Temperature: -40 Cel
No. of Terminals: 256
Package Equivalence Code: BGA256,16X16,40
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY
Length: 17 mm
Technology: CMOS
JESD-30 Code: S-PBGA-B256
Package Shape: SQUARE
Terminal Form: BALL
Maximum Operating Temperature: 70 Cel
Package Code: BGA
Width: 17 mm
Terminal Pitch: 1 mm
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