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| Manufacturer | Texas Instruments |
|---|---|
| Manufacturer's Part Number | RM46L852ZWTT |
| Description | MICROCONTROLLER, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 337; Package Code: FBGA; Package Shape: SQUARE; |
| Datasheet | RM46L852ZWTT Datasheet |
| In Stock | 713 |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Maximum Time At Peak Reflow Temperature (s): | 30 |
| Sub-Category: | Microcontrollers |
| Surface Mount: | YES |
| Maximum Supply Current: | 360 mA |
| Terminal Finish: | TIN SILVER COPPER |
| No. of Terminals: | 337 |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY, FINE PITCH |
| Technology: | CMOS |
| JESD-30 Code: | S-PBGA-B337 |
| Package Shape: | SQUARE |
| ROM Words: | 1310720 |
| Terminal Form: | BALL |
| Maximum Operating Temperature: | 105 Cel |
| Package Code: | FBGA |
| Moisture Sensitivity Level (MSL): | 3 |
| Data EEPROM Size: | 64K |
| Speed: | 220 rpm |
| Peripheral IC Type: | MICROCONTROLLER, RISC |
| RAM Bytes: | 196608 |
| Peripherals: | DMA(16), POR, PWM(14), TIMER(2), WDT |
| Bit Size: | 32 |
| JESD-609 Code: | e1 |
| Minimum Operating Temperature: | -40 Cel |
| Qualification: | Not Qualified |
| Package Equivalence Code: | BGA337,19X19,32 |
| On Chip Program ROM Width: | 8 |
| Connectivity: | CAN(3), EMI, ETHERNET, I2C, LIN, MIBSPI(3), SCI(2), SPI(2), UART(2), USB(2) |
| Peak Reflow Temperature (C): | 260 |
| ROM Programmability: | FLASH |
| Analog To Digital Convertors: | 24-Ch 12-Bit (2) |
| Terminal Pitch: | .8 mm |
| Temperature Grade: | INDUSTRIAL |
| Power Supplies (V): | 1.2,3.3 |
| CPU Family: | CORTEX-R4F |
