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Manufacturer | Texas Instruments |
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Manufacturer's Part Number | SN65LVCP114ZJA |
Description | TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 167; Package Code: LFBGA; Package Shape: SQUARE; |
Datasheet | SN65LVCP114ZJA Datasheet |
In Stock | 711 |
NAME | DESCRIPTION |
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Package Body Material: | PLASTIC/EPOXY |
Nominal Supply Voltage: | 2.5 V |
Maximum Time At Peak Reflow Temperature (s): | 30 |
Maximum Seated Height: | 1.35 mm |
Sub-Category: | Other Telecom ICs |
Surface Mount: | YES |
Terminal Finish: | TIN SILVER COPPER |
No. of Terminals: | 167 |
Terminal Position: | BOTTOM |
Package Style (Meter): | GRID ARRAY, LOW PROFILE, FINE PITCH |
Data Rate: | 14200 Mbps |
JESD-30 Code: | S-PBGA-B167 |
Package Shape: | SQUARE |
Terminal Form: | BALL |
Maximum Operating Temperature: | 85 Cel |
No. of Channels: | 8 |
Package Code: | LFBGA |
Width: | 12 mm |
Moisture Sensitivity Level (MSL): | 3 |
Telecom IC Type: | TELECOM CIRCUIT |
JESD-609 Code: | e1 |
Minimum Operating Temperature: | -40 Cel |
No. of Functions: | 4 |
Qualification: | Not Qualified |
Package Equivalence Code: | BGA167,14X14,32 |
Length: | 12 mm |
Peak Reflow Temperature (C): | 260 |
Terminal Pitch: | .8 mm |
Temperature Grade: | INDUSTRIAL |
Power Supplies (V): | 2.5/3.3 |