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| Manufacturer | Texas Instruments |
|---|---|
| Manufacturer's Part Number | SN74ALS6301FN |
| Description | MEMORY CONTROLLER, DRAM; Temperature Grade: COMMERCIAL; Terminal Form: J BEND; No. of Terminals: 68; Package Code: QCCJ; Package Shape: SQUARE; |
| Datasheet | SN74ALS6301FN Datasheet |
| In Stock | 2,902 |
| NAME | DESCRIPTION |
|---|---|
| Minimum Supply Voltage: | 4.5 V |
| Package Body Material: | PLASTIC/EPOXY |
| Nominal Supply Voltage: | 5 V |
| Maximum Time At Peak Reflow Temperature (s): | NOT SPECIFIED |
| Maximum Seated Height: | 4.57 mm |
| Sub-Category: | Memory Controllers |
| Surface Mount: | YES |
| Maximum Supply Current: | 220 mA |
| No. of Terminals: | 68 |
| Terminal Position: | QUAD |
| Package Style (Meter): | CHIP CARRIER |
| Address Bus Width: | 20 |
| Technology: | BIPOLAR |
| JESD-30 Code: | S-PQCC-J68 |
| Package Shape: | SQUARE |
| Terminal Form: | J BEND |
| Maximum Operating Temperature: | 70 Cel |
| Package Code: | QCCJ |
| Width: | 24.2316 mm |
| Peripheral IC Type: | MEMORY CONTROLLER, DRAM |
| Maximum Supply Voltage: | 5.5 V |
| Low Power Mode: | NO |
| Boundary Scan: | NO |
| Memory Organization: | 1M X 16 |
| External Data Bus Width: | 0 |
| Minimum Operating Temperature: | 0 Cel |
| No. of Banks: | 4 |
| Qualification: | Not Qualified |
| Package Equivalence Code: | LDCC68,1.0SQ |
| Length: | 24.2316 mm |
| Peak Reflow Temperature (C): | NOT SPECIFIED |
| Terminal Pitch: | 1.27 mm |
| Temperature Grade: | COMMERCIAL |
| Power Supplies (V): | 5 |
