SN74AUP1T57YFPR by Texas Instruments | Logic ICs

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Manufacturer	Texas Instruments
Manufacturer's Part Number	SN74AUP1T57YFPR
Description	BUFFER; Terminal Form: BALL; No. of Terminals: 6; Package Code: VFBGA; Package Shape: RECTANGULAR; Maximum Power Supply Current (ICC): .0052 mA;
Datasheet	SN74AUP1T57YFPR Datasheet
In Stock	2,373

NAME	DESCRIPTION
Package Body Material:	UNSPECIFIED
Maximum Seated Height:	.5 mm
No. of Inputs:	1
Minimum Supply Voltage (Vsup):	2.3 V
Maximum Power Supply Current (ICC):	.0052 mA
Surface Mount:	YES
No. of Terminals:	6
Maximum I (ol):	6 Amp
Terminal Position:	BOTTOM
Package Style (Meter):	GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Technology:	CMOS
JESD-30 Code:	R-XBGA-B6
Package Shape:	RECTANGULAR
Terminal Form:	BALL
Maximum Operating Temperature:	85 Cel
Package Code:	VFBGA
Width:	.9 mm
Load Capacitance (CL):	30 pF
Logic IC Type:	BUFFER
Minimum Operating Temperature:	-40 Cel
No. of Functions:	1
Length:	1.4 mm
Propagation Delay (tpd):	45.65 ns
Nominal Supply Voltage / Vsup (V):	2.5
Family:	AUP/ULP/V
Terminal Pitch:	.5 mm
Maximum Supply Voltage (Vsup):	3.6 V

Pricing (USD)

Qty.	Unit Price	Ext. Price
2,373	$0.269	$638.337

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