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| Manufacturer | Texas Instruments |
|---|---|
| Manufacturer's Part Number | SN74AUP1T57YZPR |
| Description | BUFFER; Terminal Form: BALL; No. of Terminals: 6; Package Code: VFBGA; Package Shape: RECTANGULAR; Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH; |
| Datasheet | SN74AUP1T57YZPR Datasheet |
| In Stock | 703 |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | UNSPECIFIED |
| Maximum Seated Height: | .5 mm |
| No. of Inputs: | 1 |
| Minimum Supply Voltage (Vsup): | 2.3 V |
| Maximum Power Supply Current (ICC): | .0052 mA |
| Surface Mount: | YES |
| No. of Terminals: | 6 |
| Maximum I (ol): | 6 Amp |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
| Technology: | CMOS |
| JESD-30 Code: | R-XBGA-B6 |
| Package Shape: | RECTANGULAR |
| Terminal Form: | BALL |
| Maximum Operating Temperature: | 85 Cel |
| Package Code: | VFBGA |
| Width: | .9 mm |
| Other Names: |
296-24736-1 296-24736-2 SN74AUP1T57YZPR-ND -SN74AUP1T57YZPR-NDR 2156-SN74AUP1T57YZPR -296-24736-1-ND TEXTISSN74AUP1T57YZPR 296-24736-6 |
| Load Capacitance (CL): | 30 pF |
| Logic IC Type: | BUFFER |
| Minimum Operating Temperature: | -40 Cel |
| No. of Functions: | 1 |
| Length: | 1.4 mm |
| Propagation Delay (tpd): | 45.65 ns |
| Nominal Supply Voltage / Vsup (V): | 2.5 |
| Family: | AUP/ULP/V |
| Terminal Pitch: | .5 mm |
| Maximum Supply Voltage (Vsup): | 3.6 V |









