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Manufacturer | Texas Instruments |
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Manufacturer's Part Number | SN74AUP1T98YFPR |
Description | INTERFACE CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 6; Package Code: VFBGA; Package Shape: RECTANGULAR; |
Datasheet | SN74AUP1T98YFPR Datasheet |
In Stock | 4,915 |
NAME | DESCRIPTION |
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Minimum Supply Voltage: | 2.3 V |
Package Body Material: | UNSPECIFIED |
Nominal Supply Voltage: | 2.5 V |
Output Characteristics: | PUSH-PULL |
Maximum Time At Peak Reflow Temperature (s): | NOT SPECIFIED |
Maximum Seated Height: | .5 mm |
Sub-Category: | Other Interface ICs |
Surface Mount: | YES |
Maximum Supply Current: | .0009 mA |
Terminal Finish: | Tin/Silver/Copper (Sn/Ag/Cu) |
No. of Terminals: | 6 |
Terminal Position: | BOTTOM |
Package Style (Meter): | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
JESD-30 Code: | R-XBGA-B6 |
Package Shape: | RECTANGULAR |
Terminal Form: | BALL |
Maximum Operating Temperature: | 85 Cel |
Package Code: | VFBGA |
Interface IC Type: | INTERFACE CIRCUIT |
Width: | .77 mm |
Moisture Sensitivity Level (MSL): | 1 |
No. of Bits: | 1 |
Maximum Supply Voltage: | 3.6 V |
JESD-609 Code: | e1 |
Minimum Operating Temperature: | -40 Cel |
No. of Functions: | 1 |
Qualification: | Not Qualified |
Length: | 1.17 mm |
Peak Reflow Temperature (C): | 260 |
Terminal Pitch: | .4 mm |
Temperature Grade: | INDUSTRIAL |
Power Supplies (V): | 2.5/3.3 |