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| Manufacturer | Texas Instruments |
|---|---|
| Manufacturer's Part Number | SN74AUP2G32YFPR |
| Description | OR GATE; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 8; Package Code: VFBGA; Package Shape: RECTANGULAR; |
| Datasheet | SN74AUP2G32YFPR Datasheet |
| In Stock | 1,245 |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | UNSPECIFIED |
| Schmitt Trigger: | NO |
| Maximum Time At Peak Reflow Temperature (s): | NOT SPECIFIED |
| Maximum Seated Height: | .5 mm |
| No. of Inputs: | 2 |
| Minimum Supply Voltage (Vsup): | .8 V |
| Sub-Category: | Gates |
| Maximum Power Supply Current (ICC): | .0009 mA |
| Surface Mount: | YES |
| Terminal Finish: | Tin/Silver/Copper (Sn/Ag/Cu) |
| No. of Terminals: | 8 |
| Maximum I (ol): | 4 Amp |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
| Technology: | CMOS |
| JESD-30 Code: | R-XBGA-B8 |
| Package Shape: | RECTANGULAR |
| Terminal Form: | BALL |
| Maximum Operating Temperature: | 85 Cel |
| Package Code: | VFBGA |
| Propagation Delay At Nominal Supply: | 25.5 ns |
| Width: | .77 mm |
| Moisture Sensitivity Level (MSL): | 1 |
| Packing Method: | TR |
| Load Capacitance (CL): | 30 pF |
| Logic IC Type: | OR GATE |
| JESD-609 Code: | e1 |
| Minimum Operating Temperature: | -40 Cel |
| No. of Functions: | 2 |
| Qualification: | Not Qualified |
| Package Equivalence Code: | BGA8,2X4,16 |
| Length: | 1.57 mm |
| Propagation Delay (tpd): | 25.5 ns |
| Nominal Supply Voltage / Vsup (V): | 1.2 |
| Family: | AUP/ULP/V |
| Peak Reflow Temperature (C): | 260 |
| Terminal Pitch: | .4 mm |
| Temperature Grade: | INDUSTRIAL |
| Maximum Supply Voltage (Vsup): | 3.6 V |
| Power Supplies (V): | 1.2/3.3 |
