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Manufacturer | Texas Instruments |
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Manufacturer's Part Number | SN74LVC1G38DPWR |
Description | NAND GATE; Temperature Grade: INDUSTRIAL; Terminal Form: BUTT; No. of Terminals: 5; Package Code: HVBCC; Package Shape: SQUARE; |
Datasheet | SN74LVC1G38DPWR Datasheet |
In Stock | 5,767 |
NAME | DESCRIPTION |
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Package Body Material: | PLASTIC/EPOXY |
Output Characteristics: | OPEN-DRAIN |
Maximum Time At Peak Reflow Temperature (s): | 30 |
Maximum Seated Height: | .4 mm |
No. of Inputs: | 2 |
Minimum Supply Voltage (Vsup): | 1.65 V |
Surface Mount: | YES |
Terminal Finish: | Nickel/Palladium/Gold (Ni/Pd/Au) |
No. of Terminals: | 5 |
Maximum I (ol): | 32 Amp |
Terminal Position: | BOTTOM |
Package Style (Meter): | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
Technology: | CMOS |
JESD-30 Code: | S-PBCC-B5 |
Package Shape: | SQUARE |
Terminal Form: | BUTT |
Maximum Operating Temperature: | 85 Cel |
Package Code: | HVBCC |
Width: | .8 mm |
Moisture Sensitivity Level (MSL): | 1 |
Logic IC Type: | NAND GATE |
JESD-609 Code: | e4 |
Minimum Operating Temperature: | -40 Cel |
No. of Functions: | 1 |
Length: | .8 mm |
Propagation Delay (tpd): | 10 ns |
Nominal Supply Voltage / Vsup (V): | 3.3 |
Family: | LVC/LCX/Z |
Peak Reflow Temperature (C): | 260 |
Temperature Grade: | INDUSTRIAL |
Maximum Supply Voltage (Vsup): | 5.5 V |