Texas Instruments - SN74LVT8986GGV

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SN74LVT8986GGV by Texas Instruments

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Manufacturer Texas Instruments
Manufacturer's Part Number SN74LVT8986GGV
Description MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 64; Package Code: LFBGA; Package Shape: SQUARE;
Datasheet SN74LVT8986GGV Datasheet
In Stock788
NAME DESCRIPTION
Minimum Supply Voltage: 2.7 V
Package Body Material: PLASTIC/EPOXY
Nominal Supply Voltage: 3 V
Maximum Time At Peak Reflow Temperature (s): 20
Maximum Seated Height: 1.4 mm
Sub-Category: Other Microprocessor ICs
Surface Mount: YES
Terminal Finish: TIN LEAD
No. of Terminals: 64
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH
Technology: BICMOS
JESD-30 Code: S-PBGA-B64
Package Shape: SQUARE
Terminal Form: BALL
Maximum Operating Temperature: 85 Cel
Package Code: LFBGA
Width: 8 mm
Moisture Sensitivity Level (MSL): 3
Peripheral IC Type: MICROPROCESSOR CIRCUIT
Maximum Supply Voltage: 3.6 V
JESD-609 Code: e0
Minimum Operating Temperature: -40 Cel
Qualification: Not Qualified
Package Equivalence Code: BGA64,8X8,32
Length: 8 mm
Peak Reflow Temperature (C): 220
Terminal Pitch: .8 mm
Temperature Grade: INDUSTRIAL
Power Supplies (V): 3.3
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Pricing (USD)

Qty. Unit Price Ext. Price
788 $6.730 $5,303.240

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