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| Manufacturer | Texas Instruments |
|---|---|
| Manufacturer's Part Number | SN74V263-6GGM |
| Description | OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 100; Package Code: LFBGA; Package Shape: SQUARE; Alternate Memory Width: 9; |
| Datasheet | SN74V263-6GGM Datasheet |
| In Stock | 364 |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Maximum Standby Current: | .015 Amp |
| Organization: | 8KX18 |
| Maximum Time At Peak Reflow Temperature (s): | 20 |
| Maximum Seated Height: | 1.4 mm |
| Minimum Supply Voltage (Vsup): | 3.15 V |
| Sub-Category: | FIFOs |
| Surface Mount: | YES |
| Maximum Supply Current: | 35 mA |
| Cycle Time: | 6 ns |
| Terminal Finish: | TIN LEAD |
| No. of Terminals: | 100 |
| Maximum Clock Frequency (fCLK): | 166 MHz |
| No. of Words: | 8192 words |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY, LOW PROFILE, FINE PITCH |
| Technology: | CMOS |
| JESD-30 Code: | S-PBGA-B100 |
| Package Shape: | SQUARE |
| Terminal Form: | BALL |
| Operating Mode: | SYNCHRONOUS |
| Maximum Operating Temperature: | 70 Cel |
| Package Code: | LFBGA |
| Width: | 10 mm |
| Moisture Sensitivity Level (MSL): | 3 |
| Memory Density: | 147456 bit |
| Memory IC Type: | OTHER FIFO |
| JESD-609 Code: | e0 |
| Minimum Operating Temperature: | 0 Cel |
| Memory Width: | 18 |
| Output Enable: | YES |
| No. of Functions: | 1 |
| Qualification: | Not Qualified |
| Package Equivalence Code: | BGA100,10X10,32 |
| Alternate Memory Width: | 9 |
| Length: | 10 mm |
| Maximum Access Time: | 4.5 ns |
| No. of Words Code: | 8K |
| Nominal Supply Voltage / Vsup (V): | 3.3 |
| Additional Features: | CAN ALSO BE CONFIGURED AS 16384 X 9 |
| Peak Reflow Temperature (C): | 220 |
| Parallel or Serial: | PARALLEL |
| Terminal Pitch: | .8 mm |
| Temperature Grade: | COMMERCIAL |
| Maximum Supply Voltage (Vsup): | 3.45 V |
| Power Supplies (V): | 3.3 |
