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| Manufacturer | Texas Instruments |
|---|---|
| Manufacturer's Part Number | TBP24SA81NP3 |
| Description | OTP ROM; Temperature Grade: COMMERCIAL; No. of Terminals: 18; Package Code: DIP; Package Shape: RECTANGULAR; Package Body Material: PLASTIC/EPOXY; |
| Datasheet | TBP24SA81NP3 Datasheet |
| In Stock | 4,671 |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Organization: | 2KX4 |
| Maximum Time At Peak Reflow Temperature (s): | NOT SPECIFIED |
| Sub-Category: | OTP ROMs |
| Surface Mount: | NO |
| No. of Terminals: | 18 |
| No. of Words: | 2048 words |
| Terminal Position: | DUAL |
| Package Style (Meter): | IN-LINE |
| Technology: | TTL |
| JESD-30 Code: | R-PDIP-T18 |
| Package Shape: | RECTANGULAR |
| Terminal Form: | THROUGH-HOLE |
| Maximum Operating Temperature: | 70 Cel |
| Package Code: | DIP |
| Memory Density: | 8192 bit |
| Memory IC Type: | OTP ROM |
| Minimum Operating Temperature: | 0 Cel |
| Memory Width: | 4 |
| Package Equivalence Code: | DIP18,.3 |
| Maximum Access Time: | 70 ns |
| No. of Words Code: | 2K |
| Peak Reflow Temperature (C): | NOT SPECIFIED |
| Terminal Pitch: | 2.54 mm |
| Temperature Grade: | COMMERCIAL |
