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Manufacturer | Texas Instruments |
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Manufacturer's Part Number | TBP38S032-25FN |
Description | OTP ROM; Temperature Grade: COMMERCIAL; No. of Terminals: 20; Package Code: QCCJ; Package Shape: SQUARE; Maximum Supply Current: 125 mA; |
Datasheet | TBP38S032-25FN Datasheet |
In Stock | 2,233 |
NAME | DESCRIPTION |
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Package Body Material: | PLASTIC/EPOXY |
Organization: | 32X8 |
Maximum Time At Peak Reflow Temperature (s): | NOT SPECIFIED |
Sub-Category: | OTP ROMs |
Surface Mount: | YES |
Maximum Supply Current: | 125 mA |
No. of Terminals: | 20 |
No. of Words: | 32 words |
Terminal Position: | QUAD |
Package Style (Meter): | CHIP CARRIER |
Technology: | TTL |
JESD-30 Code: | S-PQCC-J20 |
Package Shape: | SQUARE |
Terminal Form: | J BEND |
Maximum Operating Temperature: | 70 Cel |
Package Code: | QCCJ |
Memory IC Type: | OTP ROM |
Minimum Operating Temperature: | 0 Cel |
Memory Width: | 8 |
Qualification: | Not Qualified |
Package Equivalence Code: | LDCC20,.4SQ |
Maximum Access Time: | 25 ns |
No. of Words Code: | 32 |
Nominal Supply Voltage / Vsup (V): | 5 |
Peak Reflow Temperature (C): | NOT SPECIFIED |
Terminal Pitch: | 1.27 mm |
Temperature Grade: | COMMERCIAL |
Power Supplies (V): | 5 |