Texas Instruments - TBP38SA2X35MFK

TBP38SA2X35MFK by Texas Instruments

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Manufacturer Texas Instruments
Manufacturer's Part Number TBP38SA2X35MFK
Description OTP ROM; Temperature Grade: MILITARY; No. of Terminals: 20; Package Code: QCCN; Package Shape: SQUARE; Package Equivalence Code: LCC20,.35SQ;
Datasheet TBP38SA2X35MFK Datasheet
In Stock718
NAME DESCRIPTION
Package Body Material: CERAMIC
Organization: 256X8
Sub-Category: OTP ROMs
Surface Mount: YES
No. of Terminals: 20
No. of Words: 256 words
Terminal Position: QUAD
Package Style (Meter): CHIP CARRIER
Technology: TTL
JESD-30 Code: S-XQCC-N20
Package Shape: SQUARE
Terminal Form: NO LEAD
Maximum Operating Temperature: 125 Cel
Package Code: QCCN
Memory Density: 2048 bit
Memory IC Type: OTP ROM
Minimum Operating Temperature: -55 Cel
Memory Width: 8
Qualification: Not Qualified
Package Equivalence Code: LCC20,.35SQ
Maximum Access Time: 35 ns
No. of Words Code: 256
Nominal Supply Voltage / Vsup (V): 5
Terminal Pitch: 1.27 mm
Temperature Grade: MILITARY
Power Supplies (V): 5
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