Texas Instruments - TDA2HABDQAASRQ1

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TDA2HABDQAASRQ1 by Texas Instruments

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Manufacturer Texas Instruments
Manufacturer's Part Number TDA2HABDQAASRQ1
Description MICROPROCESSOR, RISC; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 625; Package Code: FBGA; Package Shape: SQUARE;
Datasheet TDA2HABDQAASRQ1 Datasheet
In Stock1,578
NAME DESCRIPTION
Minimum Supply Voltage: 1.11 V
Package Body Material: PLASTIC/EPOXY
Nominal Supply Voltage: 1.15 V
Integrated Cache: NO
Maximum Time At Peak Reflow Temperature (s): 30
Maximum Seated Height: 2.95 mm
Surface Mount: YES
Terminal Finish: TIN SILVER COPPER
No. of Terminals: 625
Terminal Position: BOTTOM
Format: FLOATING POINT
Package Style (Meter): GRID ARRAY, FINE PITCH
Address Bus Width: 16
Screening Level: AEC-Q100
Technology: CMOS
JESD-30 Code: S-PBGA-B625
Maximum Clock Frequency: 38.4 MHz
Package Shape: SQUARE
Terminal Form: BALL
Maximum Operating Temperature: 125 Cel
Package Code: FBGA
Width: 17 mm
Moisture Sensitivity Level (MSL): 4
Speed: 500 rpm
Peripheral IC Type: MICROPROCESSOR, RISC
Maximum Supply Voltage: 1.2 V
Low Power Mode: YES
Boundary Scan: YES
External Data Bus Width: 32
Bit Size: 32
JESD-609 Code: e1
Minimum Operating Temperature: -40 Cel
Length: 17 mm
Peak Reflow Temperature (C): 250
Terminal Pitch: .65 mm
Temperature Grade: AUTOMOTIVE
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