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Manufacturer | Texas Instruments |
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Manufacturer's Part Number | TDA3MVRBFABFRQ1 |
Description | MULTIFUNCTION PERIPHERAL; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 367; Package Code: FBGA; Package Shape: SQUARE; |
Datasheet | TDA3MVRBFABFRQ1 Datasheet |
In Stock | 3,476 |
NAME | DESCRIPTION |
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Minimum Supply Voltage: | 1.02 V |
Package Body Material: | PLASTIC/EPOXY |
Nominal Supply Voltage: | 1.06 V |
Maximum Time At Peak Reflow Temperature (s): | 30 |
Maximum Seated Height: | 2.82 mm |
Surface Mount: | YES |
Terminal Finish: | TIN SILVER COPPER |
No. of Terminals: | 367 |
No. of Serial I/Os: | 13 |
Terminal Position: | BOTTOM |
Package Style (Meter): | GRID ARRAY, FINE PITCH |
No. of I/O Lines: | 126 |
Address Bus Width: | 16 |
Screening Level: | AEC-Q100 |
Technology: | CMOS |
RAM Words: | 524288 |
JESD-30 Code: | S-PBGA-B367 |
Maximum Clock Frequency: | 38.4 MHz |
Package Shape: | SQUARE |
Terminal Form: | BALL |
Maximum Operating Temperature: | 125 Cel |
Package Code: | FBGA |
Width: | 15 mm |
Moisture Sensitivity Level (MSL): | 3 |
Peripheral IC Type: | MULTIFUNCTION PERIPHERAL |
Maximum Supply Voltage: | 1.11 V |
Boundary Scan: | YES |
External Data Bus Width: | 32 |
JESD-609 Code: | e1 |
Minimum Operating Temperature: | -40 Cel |
Package Equivalence Code: | BGA367,22X22,25 |
Length: | 15 mm |
Peak Reflow Temperature (C): | 250 |
Bus Compatibility: | CAN(2), I2C(2), QSPI, SPI(4), UART(3) |
Terminal Pitch: | .65 mm |
Temperature Grade: | AUTOMOTIVE |