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| Manufacturer | Texas Instruments |
|---|---|
| Manufacturer's Part Number | TLIN2024RGYRQ1 |
| Description | INTERFACE CIRCUIT; Temperature Grade: AUTOMOTIVE; Terminal Form: NO LEAD; No. of Terminals: 24; Package Code: HVQCCN; Package Shape: RECTANGULAR; |
| Datasheet | TLIN2024RGYRQ1 Datasheet |
| In Stock | 4,591 |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Nominal Supply Voltage: | 24 V |
| Maximum Time At Peak Reflow Temperature (s): | 30 |
| Maximum Seated Height: | 1 mm |
| Surface Mount: | YES |
| Terminal Finish: | MATTE TIN |
| No. of Terminals: | 24 |
| Terminal Position: | QUAD |
| Package Style (Meter): | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
| Data Rate: | .02 Mbps |
| Screening Level: | AEC-Q100 |
| JESD-30 Code: | R-PQCC-N24 |
| Package Shape: | RECTANGULAR |
| Terminal Form: | NO LEAD |
| Maximum Operating Temperature: | 125 Cel |
| No. of Channels: | 4 |
| Package Code: | HVQCCN |
| Width: | 3.5 mm |
| Moisture Sensitivity Level (MSL): | 2 |
| Telecom IC Type: | INTERFACE CIRCUIT |
| JESD-609 Code: | e3 |
| Minimum Operating Temperature: | -40 Cel |
| No. of Functions: | 1 |
| Length: | 5.5 mm |
| Peak Reflow Temperature (C): | 260 |
| Terminal Pitch: | .5 mm |
| Temperature Grade: | AUTOMOTIVE |
