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Manufacturer | Texas Instruments |
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Manufacturer's Part Number | TLK2711AIRCP |
Description | TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 64; Package Code: HVFQFP; Package Shape: SQUARE; |
Datasheet | TLK2711AIRCP Datasheet |
In Stock | 1,035 |
NAME | DESCRIPTION |
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Package Body Material: | PLASTIC/EPOXY |
Nominal Supply Voltage: | 2.5 V |
Maximum Time At Peak Reflow Temperature (s): | 30 |
Maximum Seated Height: | 1 mm |
Sub-Category: | Other Telecom ICs |
Surface Mount: | YES |
Terminal Finish: | NICKEL PALLADIUM GOLD |
No. of Terminals: | 64 |
Terminal Position: | QUAD |
Package Style (Meter): | FLATPACK, HEAT SINK/SLUG, VERY THIN PROFILE, FINE PITCH |
JESD-30 Code: | S-PQFP-G64 |
Package Shape: | SQUARE |
Terminal Form: | GULL WING |
Maximum Operating Temperature: | 85 Cel |
Package Code: | HVFQFP |
Width: | 10 mm |
Moisture Sensitivity Level (MSL): | 3 |
Telecom IC Type: | TELECOM CIRCUIT |
JESD-609 Code: | e4 |
Minimum Operating Temperature: | -40 Cel |
No. of Functions: | 1 |
Qualification: | Not Qualified |
Package Equivalence Code: | TQFP64,.47SQ |
Length: | 10 mm |
Peak Reflow Temperature (C): | 260 |
Terminal Pitch: | .5 mm |
Temperature Grade: | INDUSTRIAL |
Power Supplies (V): | 2.5 |