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Manufacturer | Texas Instruments |
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Manufacturer's Part Number | TLK3114SBGNT |
Description | SUPPORT CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: BALL; No. of Terminals: 289; Package Code: BGA; Package Shape: SQUARE; |
Datasheet | TLK3114SBGNT Datasheet |
In Stock | 4,794 |
NAME | DESCRIPTION |
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Package Body Material: | PLASTIC/EPOXY |
Nominal Supply Voltage: | 2.5 V |
Maximum Time At Peak Reflow Temperature (s): | NOT SPECIFIED |
Maximum Seated Height: | 2 mm |
Sub-Category: | Other Telecom ICs |
Surface Mount: | YES |
No. of Terminals: | 289 |
Terminal Position: | BOTTOM |
Package Style (Meter): | GRID ARRAY |
Technology: | CMOS |
JESD-30 Code: | S-PBGA-B289 |
Package Shape: | SQUARE |
Terminal Form: | BALL |
Maximum Operating Temperature: | 70 Cel |
Package Code: | BGA |
Width: | 19 mm |
Telecom IC Type: | SUPPORT CIRCUIT |
Minimum Operating Temperature: | 0 Cel |
No. of Functions: | 1 |
Qualification: | Not Qualified |
Package Equivalence Code: | BGA289,17X17,40 |
Length: | 19 mm |
Peak Reflow Temperature (C): | NOT SPECIFIED |
Terminal Pitch: | 1 mm |
Temperature Grade: | COMMERCIAL |
Power Supplies (V): | 1.5/2.5,2.5 |