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| Manufacturer | Texas Instruments |
|---|---|
| Manufacturer's Part Number | TLK3118GDV |
| Description | SUPPORT CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: BALL; No. of Terminals: 400; Package Code: HBGA; Package Shape: SQUARE; |
| Datasheet | TLK3118GDV Datasheet |
| In Stock | 619 |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Nominal Supply Voltage: | 1.2 V |
| Maximum Time At Peak Reflow Temperature (s): | 20 |
| Maximum Seated Height: | 3.65 mm |
| Sub-Category: | Other Telecom ICs |
| Surface Mount: | YES |
| Terminal Finish: | TIN LEAD |
| No. of Terminals: | 400 |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY, HEAT SINK/SLUG |
| Technology: | CMOS |
| JESD-30 Code: | S-PBGA-B400 |
| Package Shape: | SQUARE |
| Terminal Form: | BALL |
| Maximum Operating Temperature: | 70 Cel |
| Package Code: | HBGA |
| Width: | 21 mm |
| Moisture Sensitivity Level (MSL): | 4 |
| Telecom IC Type: | SUPPORT CIRCUIT |
| JESD-609 Code: | e0 |
| Minimum Operating Temperature: | 0 Cel |
| No. of Functions: | 1 |
| Qualification: | Not Qualified |
| Package Equivalence Code: | BGA400,20X20,40 |
| Length: | 21 mm |
| Peak Reflow Temperature (C): | 220 |
| Terminal Pitch: | 1 mm |
| Temperature Grade: | COMMERCIAL |
| Power Supplies (V): | 1.2,1.5,2.5 |
