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Manufacturer | Texas Instruments |
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Manufacturer's Part Number | TM4C123BH6ZRBIR |
Description | MICROCONTROLLER, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 157; Package Code: VFBGA; Package Shape: SQUARE; |
Datasheet | TM4C123BH6ZRBIR Datasheet |
In Stock | 392 |
NAME | DESCRIPTION |
---|---|
Minimum Supply Voltage: | 1.08 V |
Package Body Material: | PLASTIC/EPOXY |
Maximum Time At Peak Reflow Temperature (s): | 30 |
Sub-Category: | Microcontrollers |
Surface Mount: | YES |
Address Bus Width: | 0 |
Technology: | CMOS |
Maximum Clock Frequency: | 25 MHz |
Package Shape: | SQUARE |
Terminal Form: | BALL |
Package Code: | VFBGA |
Moisture Sensitivity Level (MSL): | 3 |
Bit Size: | 32 |
DAC Channels: | NO |
Qualification: | Not Qualified |
Package Equivalence Code: | BGA157,13X13,25 |
PWM Channels: | YES |
Connectivity: | CAN(2), I2C(6), IRDA, MICROWIRE, SPI, SSI(4), UART(8) |
Peak Reflow Temperature (C): | 260 |
ROM Programmability: | FLASH |
Analog To Digital Convertors: | 24-Ch 12-Bit |
Terminal Pitch: | .65 mm |
CPU Family: | CORTEX-M4F |
Nominal Supply Voltage: | 1.2 V |
Maximum Seated Height: | 1 mm |
Terminal Finish: | TIN SILVER COPPER |
ADC Channels: | YES |
No. of Terminals: | 157 |
DMA Channels: | YES |
Terminal Position: | BOTTOM |
Package Style (Meter): | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
No. of I/O Lines: | 120 |
JESD-30 Code: | S-PBGA-B157 |
ROM Words: | 262144 |
Maximum Operating Temperature: | 85 Cel |
Width: | 9 mm |
Data EEPROM Size: | 2K |
Speed: | 80 rpm |
Peripheral IC Type: | MICROCONTROLLER, RISC |
Maximum Supply Voltage: | 1.32 V |
RAM Bytes: | 32768 |
External Data Bus Width: | 0 |
Peripherals: | BOD, COMPARATOR(3), DMA(32), POR, PWM(16), QEI(2), RTC, TIMER(13), WDT(2) |
JESD-609 Code: | e1 |
Minimum Operating Temperature: | -40 Cel |
Length: | 9 mm |
On Chip Program ROM Width: | 8 |
Temperature Grade: | INDUSTRIAL |
Power Supplies (V): | 3.3 |