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Manufacturer | Texas Instruments |
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Manufacturer's Part Number | TMS320C6657GZHA |
Description | DIGITAL SIGNAL PROCESSOR, OTHER; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 625; Package Code: FBGA; Package Shape: SQUARE; |
Datasheet | TMS320C6657GZHA Datasheet |
In Stock | 263 |
NAME | DESCRIPTION |
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Package Body Material: | PLASTIC/EPOXY |
Integrated Cache: | YES |
Maximum Time At Peak Reflow Temperature (s): | 20 |
Maximum Seated Height: | 2.99 mm |
Sub-Category: | Digital Signal Processors |
Surface Mount: | YES |
Terminal Finish: | TIN LEAD |
On Chip Data RAM Width: | 8 |
No. of Terminals: | 625 |
No. of Timers: | 8 |
Terminal Position: | BOTTOM |
Format: | FLOATING POINT |
Package Style (Meter): | GRID ARRAY, FINE PITCH |
No. of DMA Channels: | 72 |
Address Bus Width: | 24 |
Technology: | CMOS |
RAM Words: | 8192 |
JESD-30 Code: | S-PBGA-B625 |
Package Shape: | SQUARE |
Terminal Form: | BALL |
Maximum Operating Temperature: | 100 Cel |
Package Code: | FBGA |
Width: | 21 mm |
Moisture Sensitivity Level (MSL): | 3 |
Peripheral IC Type: | DIGITAL SIGNAL PROCESSOR, OTHER |
Low Power Mode: | YES |
Boundary Scan: | YES |
External Data Bus Width: | 16 |
Bit Size: | 32 |
Barrel Shifter: | NO |
JESD-609 Code: | e0 |
Minimum Operating Temperature: | -40 Cel |
Internal Bus Architecture: | MULTIPLE |
Qualification: | Not Qualified |
Package Equivalence Code: | BGA625,25X25,32 |
Length: | 21 mm |
On Chip Program ROM Width: | 8 |
Peak Reflow Temperature (C): | 220 |
ROM Programmability: | MROM |
Terminal Pitch: | .8 mm |
Temperature Grade: | INDUSTRIAL |
Power Supplies (V): | 1,1.5,1.8 |