Texas Instruments - TMS320DM355DZCE27J

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TMS320DM355DZCE27J by Texas Instruments

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Manufacturer Texas Instruments
Manufacturer's Part Number TMS320DM355DZCE27J
Description MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 337; Package Code: LFBGA; Package Shape: SQUARE;
Datasheet TMS320DM355DZCE27J Datasheet
In Stock2,685
NAME DESCRIPTION
Minimum Supply Voltage: 1.235 V
Package Body Material: PLASTIC/EPOXY
Nominal Supply Voltage: 1.3 V
Maximum Time At Peak Reflow Temperature (s): 30
Maximum Seated Height: 1.3 mm
Sub-Category: Digital Signal Processors
Surface Mount: YES
Terminal Finish: TIN SILVER COPPER
No. of Terminals: 337
Terminal Position: BOTTOM
Format: FIXED POINT
Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH
Technology: CMOS
RAM Words: 8192
JESD-30 Code: S-PBGA-B337
Package Shape: SQUARE
Terminal Form: BALL
Maximum Operating Temperature: 85 Cel
Package Code: LFBGA
Width: 13 mm
Moisture Sensitivity Level (MSL): 3
Peripheral IC Type: MICROPROCESSOR CIRCUIT
Maximum Supply Voltage: 1.365 V
Bit Size: 32
JESD-609 Code: e1
Minimum Operating Temperature: 0 Cel
Qualification: Not Qualified
Package Equivalence Code: BGA337,19X19,25
Length: 13 mm
Additional Features: IT ALSO OPERATES AT 1.8V AND 3.3V SUPPLY FOR I/O
Peak Reflow Temperature (C): 260
Terminal Pitch: .65 mm
Temperature Grade: OTHER
Power Supplies (V): 1.3,1.8,3.3
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