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Manufacturer | Texas Instruments |
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Manufacturer's Part Number | TMS320TCI6482BCTZA |
Description | Digital Signal Processors; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 697; Package Code: HBGA; Package Shape: SQUARE; |
Datasheet | TMS320TCI6482BCTZA Datasheet |
In Stock | 3,936 |
NAME | DESCRIPTION |
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Package Body Material: | PLASTIC/EPOXY |
Maximum Time At Peak Reflow Temperature (s): | 30 |
Sub-Category: | Digital Signal Processors |
Surface Mount: | YES |
Terminal Finish: | TIN SILVER COPPER |
No. of Terminals: | 697 |
Terminal Position: | BOTTOM |
Format: | FIXED POINT |
Package Style (Meter): | GRID ARRAY, HEAT SINK/SLUG |
Technology: | CMOS |
RAM Words: | 8192 |
JESD-30 Code: | S-PBGA-B697 |
Package Shape: | SQUARE |
Terminal Form: | BALL |
Maximum Operating Temperature: | 105 Cel |
Package Code: | HBGA |
Moisture Sensitivity Level (MSL): | 4 |
Bit Size: | 32 |
JESD-609 Code: | e1 |
Minimum Operating Temperature: | -40 Cel |
Qualification: | Not Qualified |
Package Equivalence Code: | BGA697,29X29,32 |
Peak Reflow Temperature (C): | 245 |
Terminal Pitch: | .8 mm |
Temperature Grade: | INDUSTRIAL |
Power Supplies (V): | 1.25,1.5/1.8,1.8,3.3 |