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Manufacturer | Texas Instruments |
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Manufacturer's Part Number | TMS320VC5509AGBB |
Description | DIGITAL SIGNAL PROCESSOR, OTHER; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 179; Package Shape: RECTANGULAR; Package Body Material: PLASTIC/EPOXY; |
Datasheet | TMS320VC5509AGBB Datasheet |
In Stock | 7,426 |
NAME | DESCRIPTION |
---|---|
Minimum Supply Voltage: | 1.55 V |
Package Body Material: | PLASTIC/EPOXY |
Nominal Supply Voltage: | 1.6 V |
Integrated Cache: | NO |
Maximum Time At Peak Reflow Temperature (s): | 20 |
Surface Mount: | YES |
Terminal Finish: | TIN LEAD |
On Chip Data RAM Width: | 16 |
No. of Terminals: | 179 |
No. of Timers: | 2 |
Terminal Position: | BOTTOM |
Format: | FIXED POINT |
Address Bus Width: | 21 |
Technology: | CMOS |
RAM Words: | 128K |
JESD-30 Code: | R-PBGA-B179 |
Maximum Clock Frequency: | 20 MHz |
Package Shape: | RECTANGULAR |
Terminal Form: | BALL |
Maximum Operating Temperature: | 85 Cel |
Moisture Sensitivity Level (MSL): | 3 |
Peripheral IC Type: | DIGITAL SIGNAL PROCESSOR, OTHER |
Maximum Supply Voltage: | 1.65 V |
Low Power Mode: | YES |
Boundary Scan: | YES |
External Data Bus Width: | 16 |
Barrel Shifter: | NO |
JESD-609 Code: | e0 |
Minimum Operating Temperature: | -40 Cel |
Internal Bus Architecture: | MULTIPLE |
Package Equivalence Code: | BGA179(UNSPEC) |
On Chip Program ROM Width: | 16 |
Peak Reflow Temperature (C): | 220 |
ROM Programmability: | FLASH |
Temperature Grade: | INDUSTRIAL |