Texas Instruments - TMS32C6203BGLS173H

TMS32C6203BGLS173H by Texas Instruments

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Manufacturer Texas Instruments
Manufacturer's Part Number TMS32C6203BGLS173H
Description DIGITAL SIGNAL PROCESSOR, OTHER; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 384; Package Code: HFBGA; Package Shape: SQUARE;
Datasheet TMS32C6203BGLS173H Datasheet
In Stock873
NAME DESCRIPTION
Minimum Supply Voltage: 1.65 V
Package Body Material: PLASTIC/EPOXY
Nominal Supply Voltage: 1.7 V
Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED
Maximum Seated Height: 2.8 mm
Sub-Category: Digital Signal Processors
Surface Mount: YES
No. of Terminals: 384
Terminal Position: BOTTOM
Format: FIXED POINT
Package Style (Meter): GRID ARRAY, HEAT SINK/SLUG, FINE PITCH
Address Bus Width: 22
Technology: CMOS
RAM Words: 524288
JESD-30 Code: S-PBGA-B384
Maximum Clock Frequency: 300 MHz
Package Shape: SQUARE
Terminal Form: BALL
Maximum Operating Temperature: 90 Cel
Package Code: HFBGA
Width: 18 mm
Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER
Maximum Supply Voltage: 1.75 V
Low Power Mode: YES
Boundary Scan: YES
External Data Bus Width: 32
Bit Size: 32
Barrel Shifter: NO
Minimum Operating Temperature: 0 Cel
Internal Bus Architecture: MULTIPLE
Qualification: Not Qualified
Package Equivalence Code: BGA384,22X22,32
Length: 18 mm
Additional Features: ALSO REQUIRES 3.3V SUPPLY
Peak Reflow Temperature (C): NOT SPECIFIED
Terminal Pitch: .8 mm
Temperature Grade: OTHER
Power Supplies (V): 1.5,3.3
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Pricing (USD)

Qty. Unit Price Ext. Price
873 $58.460 $51,035.580

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