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| Manufacturer | Texas Instruments |
|---|---|
| Manufacturer's Part Number | TMS32C6416EGLZ5E0 |
| Description | DIGITAL SIGNAL PROCESSOR, OTHER; Terminal Form: BALL; No. of Terminals: 532; Package Code: HFBGA; Package Shape: SQUARE; Address Bus Width: 32; |
| Datasheet | TMS32C6416EGLZ5E0 Datasheet |
| In Stock | 1,762 |
| NAME | DESCRIPTION |
|---|---|
| Minimum Supply Voltage: | 1.14 V |
| Package Body Material: | PLASTIC/EPOXY |
| Nominal Supply Voltage: | 1.2 V |
| Maximum Time At Peak Reflow Temperature (s): | 20 |
| Maximum Seated Height: | 3.3 mm |
| Sub-Category: | Digital Signal Processors |
| Surface Mount: | YES |
| Terminal Finish: | TIN LEAD |
| No. of Terminals: | 532 |
| Terminal Position: | BOTTOM |
| Format: | FIXED POINT |
| Package Style (Meter): | GRID ARRAY, HEAT SINK/SLUG, FINE PITCH |
| Address Bus Width: | 32 |
| Technology: | CMOS |
| RAM Words: | 16384 |
| JESD-30 Code: | S-PBGA-B532 |
| Maximum Clock Frequency: | 75.18 MHz |
| Package Shape: | SQUARE |
| Terminal Form: | BALL |
| Package Code: | HFBGA |
| Width: | 23 mm |
| Moisture Sensitivity Level (MSL): | 4 |
| Peripheral IC Type: | DIGITAL SIGNAL PROCESSOR, OTHER |
| Maximum Supply Voltage: | 1.26 V |
| Low Power Mode: | YES |
| Boundary Scan: | YES |
| External Data Bus Width: | 64 |
| Bit Size: | 32 |
| Barrel Shifter: | NO |
| JESD-609 Code: | e0 |
| Internal Bus Architecture: | MULTIPLE |
| Qualification: | Not Qualified |
| Package Equivalence Code: | BGA532,26X26,32 |
| Length: | 23 mm |
| Additional Features: | ALSO REQUIRES 3.3VI/O SUPPLY |
| Peak Reflow Temperature (C): | 220 |
| Terminal Pitch: | .8 mm |
| Power Supplies (V): | 1.2,3.3 |
