Image shown is a representation only.
| Manufacturer | Texas Instruments |
|---|---|
| Manufacturer's Part Number | TMS4C1070-60N |
| Description | MEMORY CIRCUIT; Temperature Grade: COMMERCIAL; No. of Terminals: 18; Package Code: DIP; Package Shape: RECTANGULAR; Technology: CMOS; |
| Datasheet | TMS4C1070-60N Datasheet |
| In Stock | 77 |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Maximum Standby Current: | .01 Amp |
| Maximum Time At Peak Reflow Temperature (s): | NOT SPECIFIED |
| Sub-Category: | Other Memory ICs |
| Surface Mount: | NO |
| Maximum Supply Current: | 35 mA |
| No. of Terminals: | 18 |
| Terminal Position: | DUAL |
| Package Style (Meter): | IN-LINE |
| Technology: | CMOS |
| JESD-30 Code: | R-PDIP-T18 |
| Package Shape: | RECTANGULAR |
| Terminal Form: | THROUGH-HOLE |
| Maximum Operating Temperature: | 70 Cel |
| Package Code: | DIP |
| Memory IC Type: | MEMORY CIRCUIT |
| Minimum Operating Temperature: | 0 Cel |
| Qualification: | Not Qualified |
| Package Equivalence Code: | DIP18,.3 |
| Maximum Access Time: | 50 ns |
| Nominal Supply Voltage / Vsup (V): | 5 |
| Peak Reflow Temperature (C): | NOT SPECIFIED |
| Terminal Pitch: | 2.54 mm |
| Temperature Grade: | COMMERCIAL |
| Power Supplies (V): | 5 |
