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| Manufacturer | Texas Instruments |
|---|---|
| Manufacturer's Part Number | TMS5703137BZWTQQ1 |
| Description | MICROCONTROLLER, RISC; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 337; Package Code: LFBGA; Package Shape: SQUARE; |
| Datasheet | TMS5703137BZWTQQ1 Datasheet |
| In Stock | 1,321 |
| NAME | DESCRIPTION |
|---|---|
| Minimum Supply Voltage: | 1.14 V |
| Package Body Material: | PLASTIC/EPOXY |
| Nominal Supply Voltage: | 1.2 V |
| Maximum Time At Peak Reflow Temperature (s): | 30 |
| Maximum Seated Height: | 1.4 mm |
| Sub-Category: | Microcontrollers |
| Surface Mount: | YES |
| Maximum Supply Current: | 440 mA |
| Terminal Finish: | TIN SILVER COPPER |
| ADC Channels: | YES |
| No. of Terminals: | 337 |
| DMA Channels: | YES |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY, LOW PROFILE, FINE PITCH |
| No. of I/O Lines: | 16 |
| Address Bus Width: | 22 |
| Screening Level: | AEC-Q100 |
| Technology: | CMOS |
| JESD-30 Code: | S-PBGA-B337 |
| Maximum Clock Frequency: | 80 MHz |
| Package Shape: | SQUARE |
| ROM Words: | 3145728 |
| Terminal Form: | BALL |
| Maximum Operating Temperature: | 125 Cel |
| Package Code: | LFBGA |
| Width: | 16 mm |
| Moisture Sensitivity Level (MSL): | 3 |
| Speed: | 180 rpm |
| Peripheral IC Type: | MICROCONTROLLER, RISC |
| Maximum Supply Voltage: | 1.32 V |
| RAM Bytes: | 262144 |
| External Data Bus Width: | 32 |
| Bit Size: | 32 |
| DAC Channels: | NO |
| JESD-609 Code: | e1 |
| Minimum Operating Temperature: | -40 Cel |
| Qualification: | Not Qualified |
| Package Equivalence Code: | BGA337,19X19,32 |
| Length: | 16 mm |
| PWM Channels: | YES |
| Peak Reflow Temperature (C): | 260 |
| ROM Programmability: | FLASH |
| Terminal Pitch: | .8 mm |
| Temperature Grade: | AUTOMOTIVE |
| Power Supplies (V): | 1.2,3.3 |
| CPU Family: | CORTEX-R4F |
