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Manufacturer | Texas Instruments |
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Manufacturer's Part Number | TMX320C6701GJC |
Description | DIGITAL SIGNAL PROCESSOR, OTHER; Terminal Form: BALL; No. of Terminals: 352; Package Code: HBGA; Package Shape: SQUARE; Package Equivalence Code: BGA352,26X26,50; |
Datasheet | TMX320C6701GJC Datasheet |
In Stock | 3,277 |
NAME | DESCRIPTION |
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Minimum Supply Voltage: | 3.14 V |
Package Body Material: | PLASTIC/EPOXY |
Nominal Supply Voltage: | 3.3 V |
Maximum Time At Peak Reflow Temperature (s): | NOT SPECIFIED |
Maximum Seated Height: | 3.5 mm |
Sub-Category: | Digital Signal Processors |
Surface Mount: | YES |
No. of Terminals: | 352 |
Terminal Position: | BOTTOM |
Format: | FLOATING POINT |
Package Style (Meter): | GRID ARRAY, HEAT SINK/SLUG |
Address Bus Width: | 22 |
Technology: | CMOS |
RAM Words: | 16384 |
JESD-30 Code: | S-PBGA-B352 |
Maximum Clock Frequency: | 167 MHz |
Package Shape: | SQUARE |
Terminal Form: | BALL |
Package Code: | HBGA |
Width: | 35 mm |
Peripheral IC Type: | DIGITAL SIGNAL PROCESSOR, OTHER |
Maximum Supply Voltage: | 3.46 V |
Low Power Mode: | YES |
Boundary Scan: | YES |
External Data Bus Width: | 32 |
Bit Size: | 32 |
Barrel Shifter: | NO |
Internal Bus Architecture: | MULTIPLE |
Qualification: | Not Qualified |
Package Equivalence Code: | BGA352,26X26,50 |
Length: | 35 mm |
Peak Reflow Temperature (C): | NOT SPECIFIED |
Terminal Pitch: | 1.27 mm |
Power Supplies (V): | 1.8,3.3 |