Texas Instruments - TMX320DM365AZCE

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TMX320DM365AZCE by Texas Instruments

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Manufacturer Texas Instruments
Manufacturer's Part Number TMX320DM365AZCE
Description MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 338; Package Code: FBGA; Package Shape: SQUARE; Package Style (Meter): GRID ARRAY, FINE PITCH;
Datasheet TMX320DM365AZCE Datasheet
In Stock912
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Peripheral IC Type: MICROPROCESSOR CIRCUIT
Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED
Sub-Category: Digital Signal Processors
Surface Mount: YES
Bit Size: 32
No. of Terminals: 338
Qualification: Not Qualified
Package Equivalence Code: BGA338,19X19,25
Terminal Position: BOTTOM
Format: FIXED POINT
Package Style (Meter): GRID ARRAY, FINE PITCH
Technology: CMOS
RAM Words: 2048
JESD-30 Code: S-PBGA-B338
Package Shape: SQUARE
Terminal Form: BALL
Peak Reflow Temperature (C): NOT SPECIFIED
Package Code: FBGA
Terminal Pitch: .635 mm
Power Supplies (V): 1.2,1.8/3.3
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