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| Manufacturer | Texas Instruments |
|---|---|
| Manufacturer's Part Number | TMX370C756FJS |
| Description | Microcontrollers; Temperature Grade: OTHER; Terminal Form: J BEND; No. of Terminals: 68; Package Code: QCCJ; Package Shape: SQUARE; |
| Datasheet | TMX370C756FJS Datasheet |
| In Stock | 693 |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | CERAMIC |
| Nominal Supply Voltage: | 5 V |
| Sub-Category: | Microcontrollers |
| Surface Mount: | YES |
| Maximum Supply Current: | 95 mA |
| No. of Terminals: | 68 |
| Terminal Position: | QUAD |
| Package Style (Meter): | CHIP CARRIER |
| Technology: | CMOS |
| JESD-30 Code: | S-XQCC-J68 |
| Package Shape: | SQUARE |
| ROM Words: | 16384 |
| Terminal Form: | J BEND |
| Maximum Operating Temperature: | 25 Cel |
| Package Code: | QCCJ |
| Speed: | 5 rpm |
| RAM Bytes: | 512 |
| Bit Size: | 8 |
| Minimum Operating Temperature: | 25 Cel |
| Qualification: | Not Qualified |
| Package Equivalence Code: | LDCC68,1.0SQ |
| ROM Programmability: | UVPROM |
| Terminal Pitch: | 1.27 mm |
| Temperature Grade: | OTHER |
| Power Supplies (V): | 5 |
| CPU Family: | TMS370 |
