TNETX3150AGGP by Texas Instruments | Telecommunications

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Manufacturer	Texas Instruments
Manufacturer's Part Number	TNETX3150AGGP
Description	SUPPORT CIRCUIT; Terminal Form: BALL; No. of Terminals: 352; Package Code: LBGA; Package Shape: SQUARE; Terminal Position: BOTTOM;
Datasheet	TNETX3150AGGP Datasheet
In Stock	137

NAME	DESCRIPTION
Package Body Material:	PLASTIC/EPOXY
Nominal Supply Voltage:	3.3 V
Maximum Time At Peak Reflow Temperature (s):	NOT SPECIFIED
Telecom IC Type:	SUPPORT CIRCUIT
Maximum Seated Height:	1.7 mm
Sub-Category:	Network Interfaces
Surface Mount:	YES
Maximum Supply Current:	.55 mA
No. of Functions:	1
No. of Terminals:	352
Qualification:	Not Qualified
Package Equivalence Code:	BGA352,26X26,50
Terminal Position:	BOTTOM
Package Style (Meter):	GRID ARRAY, LOW PROFILE
Length:	35 mm
Technology:	CMOS
JESD-30 Code:	S-PBGA-B352
Package Shape:	SQUARE
Terminal Form:	BALL
Peak Reflow Temperature (C):	NOT SPECIFIED
Package Code:	LBGA
Width:	35 mm
Terminal Pitch:	1.27 mm
Power Supplies (V):	3.3,5

Pricing (USD)

Qty.	Unit Price	Ext. Price
137	-	-

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OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;

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