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| Manufacturer | Texas Instruments |
|---|---|
| Manufacturer's Part Number | TNETX3150GGP |
| Description | SUPPORT CIRCUIT; Terminal Form: BALL; No. of Terminals: 352; Package Code: LBGA; Package Shape: SQUARE; No. of Functions: 1; |
| Datasheet | TNETX3150GGP Datasheet |
| In Stock | 101 |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Nominal Supply Voltage: | 3.3 V |
| Maximum Time At Peak Reflow Temperature (s): | NOT SPECIFIED |
| Telecom IC Type: | SUPPORT CIRCUIT |
| Maximum Seated Height: | 1.7 mm |
| Sub-Category: | Network Interfaces |
| Surface Mount: | YES |
| Maximum Supply Current: | 1.5 mA |
| No. of Functions: | 1 |
| No. of Terminals: | 352 |
| Qualification: | Not Qualified |
| Package Equivalence Code: | BGA352,26X26,50 |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY, LOW PROFILE |
| Length: | 35 mm |
| Technology: | CMOS |
| JESD-30 Code: | S-PBGA-B352 |
| Package Shape: | SQUARE |
| Terminal Form: | BALL |
| Peak Reflow Temperature (C): | NOT SPECIFIED |
| Package Code: | LBGA |
| Width: | 35 mm |
| Terminal Pitch: | 1.27 mm |
| Power Supplies (V): | 3.3,5 |
