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Manufacturer | Texas Instruments |
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Manufacturer's Part Number | TS3DDR32611ZQCR |
Description | SPST; Package Code: VFBGA; Package Shape: SQUARE; Surface Mount: YES; Terminal Form: BALL; JESD-30 Code: S-PBGA-B48; |
Datasheet | TS3DDR32611ZQCR Datasheet |
In Stock | 3,640 |
NAME | DESCRIPTION |
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Package Body Material: | PLASTIC/EPOXY |
Minimum Input Voltage: | 1.2 V |
Maximum Time At Peak Reflow Temperature (s): | 30 |
Maximum Input Voltage: | 1.5 V |
Normal Position (V): | NO |
Maximum Supply Current (Isup): | .22 mA |
Surface Mount: | YES |
Terminal Finish: | TIN SILVER COPPER |
JESD-609 Code: | e1 |
Terminal Position: | BOTTOM |
Package Style (Meter): | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
Other IC type: | SPST |
JESD-30 Code: | S-PBGA-B48 |
Output (V): | SEPARATE OUTPUT |
Package Shape: | SQUARE |
Terminal Form: | BALL |
Peak Reflow Temperature (C): | 260 |
No. of Channels: | 26 |
Package Code: | VFBGA |
Moisture Sensitivity Level (MSL): | 2 |