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Manufacturer | Texas Instruments |
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Manufacturer's Part Number | TSB83AA23ZAY |
Description | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL; Temperature Grade: COMMERCIAL; Terminal Form: BALL; No. of Terminals: 167; Package Code: LFBGA; Package Shape: SQUARE; |
Datasheet | TSB83AA23ZAY Datasheet |
In Stock | 4,911 |
NAME | DESCRIPTION |
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Package Body Material: | PLASTIC/EPOXY |
Maximum Time At Peak Reflow Temperature (s): | NOT SPECIFIED |
Maximum Seated Height: | 1.4 mm |
Sub-Category: | Bus Controllers |
Surface Mount: | YES |
Maximum Supply Current: | 120 mA |
Terminal Finish: | Tin/Silver/Copper (Sn/Ag/Cu) |
No. of Terminals: | 167 |
Terminal Position: | BOTTOM |
Package Style (Meter): | GRID ARRAY |
Maximum Data Transfer Rate: | 100 MBps |
Technology: | CMOS |
JESD-30 Code: | S-PBGA-B167 |
Maximum Clock Frequency: | 33 MHz |
Package Shape: | SQUARE |
Terminal Form: | BALL |
Maximum Operating Temperature: | 70 Cel |
Package Code: | LFBGA |
Width: | 12 mm |
Moisture Sensitivity Level (MSL): | 3 |
Peripheral IC Type: | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
Low Power Mode: | NO |
Boundary Scan: | YES |
Communication Protocol: | IEEE1394 |
JESD-609 Code: | e1 |
Minimum Operating Temperature: | 0 Cel |
Qualification: | Not Qualified |
Package Equivalence Code: | BGA167,14X14,32 |
Length: | 12 mm |
Peak Reflow Temperature (C): | 260 |
Bus Compatibility: | PCI |
Terminal Pitch: | .8 mm |
Temperature Grade: | COMMERCIAL |
Power Supplies (V): | 1.9,3.3 |