Texas Instruments - TSP60C19N

TSP60C19N by Texas Instruments

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Manufacturer Texas Instruments
Manufacturer's Part Number TSP60C19N
Description MASK ROM; Temperature Grade: OTHER; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR; Power Supplies (V): 5;
Datasheet TSP60C19N Datasheet
In Stock337
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Maximum Standby Current: .0001 Amp
Organization: 16KX16
Sub-Category: MASK ROMs
Surface Mount: NO
Maximum Supply Current: .3 mA
No. of Terminals: 16
No. of Words: 16384 words
Terminal Position: DUAL
Package Style (Meter): IN-LINE
Technology: CMOS
JESD-30 Code: R-PDIP-T16
Package Shape: RECTANGULAR
Terminal Form: THROUGH-HOLE
Maximum Operating Temperature: 80 Cel
Package Code: DIP
Memory Density: 262144 bit
Memory IC Type: MASK ROM
Minimum Operating Temperature: -40 Cel
Memory Width: 16
Qualification: Not Qualified
Package Equivalence Code: DIP16,.3
No. of Words Code: 16K
Nominal Supply Voltage / Vsup (V): 5
Terminal Pitch: 2.54 mm
Temperature Grade: OTHER
Power Supplies (V): 5
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